Chipmaker TSMC has signed a Memorandum of Understanding (MoU) with US semiconductor product packaging and test services company, Amkor Technology. Following their agreement, Amkor will provide TSMC with turnkey advanced packaging and test services at its planned outsourced semiconductor assembly and test company (OSAT) plant in Peoria, Arizona.
"Amkor is proud to collaborate with TSMC to provide seamless integration of silicon manufacturing and packaging processes through an efficient turnkey advanced packaging and test business model in the United States,” said Giel Rutten, Amkor’s president and CEO. “This expanded partnership underscores our commitment to driving innovation and advancing semiconductor technology while ensuring resilient supply chains."
“Our customers are increasingly depending on advanced packaging technologies for their breakthroughs in advanced mobile applications, artificial intelligence, and high-performance computing, and TSMC is pleased to work side by side with a trusted longtime strategic partner in Amkor to support them with a more diverse manufacturing footprint,” added Dr. Kevin Zhang, TSMC’s SVP of business development and global sales, and deputy joint COO. “We look forward to close collaboration with Amkor at their Peoria facility to maximize the value of our fabs in Phoenix and provide more comprehensive services to our customers in the United States.”
