Microsoft Azure: Ansys and TSMC to partner with Microsoft for silicon photonic simulations

Ansys and TSMC have teamed up with Microsoft to enhance the simulation and analysis of silicon photonic components. Silicon Photonic Integrated Circuit (PIC) technology is a type of optical communication that speeds up data transfer speeds and is used in data centers and IoT applications.

“The size and complexity of our multiphysics silicon solutions makes the process of simulating all possible parameter combinations challenging,” said Stefan Rusu, head of silicon photonics system design at TSMC. “This latest collaboration again highlights that Ansys effectively harnesses the latest cloud infrastructure and techniques to deliver powerful, predictively accurate solutions that produce results in a fraction of the time.”

Shelly Blackburn, CVP of Azure infrastructure, digital and app innovation at Microsoft, added: “Our collaboration is a significant advantage for users seeking the combined power of HPC and AI (artificial intelligence), using the flexibility of cloud solutions while maintaining the familiar on-premises experience. By working together, we aim to address the complexities of large-scale designs essential for high-quality semiconductor products. Utilizing the power and scalability of Microsoft Azure’s cloud computing is a key strategy in overcoming these challenges.”