Micron to Break Ground on New York Megafab Campus Next Week

Memory chipmaker Micron will break ground on a $100 billion semiconductor fab campus in Onondaga County, New York, on January 16. Consisting of four fabs when fully built, the so-called megafab is expected to be complete by Q3 2041 and will be the largest semiconductor facility in the US.

In a statement announcing the forthcoming groundbreaking, Micron said the project represents the “largest private investment in New York state history,” with the campus set to house “the most advanced memory manufacturing in the world.”

“Breaking ground at Micron’s New York megafab is a pivotal moment for Micron and the United States,” said Mehrotra. “I want to thank President Trump, Secretary Lutnick, Administrator Zeldin, Governor Hochul, Senator Schumer, Congressman Mannion, Congresswoman Tenney, County Executive McMahon, and all of our partners in the administration and Congress for their leadership and partnership in getting to this milestone.

“As the global economy enters the AI era, leadership in advanced semiconductors will be the cornerstone of innovation and economic prosperity. Our investments and progress solidify our position as the only United States manufacturer of memory.”