STMicroelectronics has launched a new data center photonics chip, developed in collaboration with Amazon Web Services (AWS). The PIC100 chip was developed to support incoming 800Gbps and 1.6Tbps optical interconnects across all workloads, including artificial intelligence (AI).
“AI is changing the market, and it's pushing for higher speed, higher bandwidth, and a more energy-efficient solution. Today, STMicroelectronics has announced a comprehensive technology answer to that change, with silicon photonics and BiCMOS,” said Vincent Fraisse, general manager at the company's radio and communications chip division. “PIC100… has an innovative stack up and unparalleled performance for a new class of throughput, 300mm manufacturing for best in class yields, and, of course, a long-term roadmap for future additions to PIC100, with TSV (through-silicon via), faster modulators using foreign materials, and more integration.”
Nafea Bshara, VP and distinguished engineer at AWS, added: "AWS is working with STMicroelectronics based on their demonstrated capability to make PIC100 a leading silicon photonics technology for the optical and AI market. We are enthusiastic about the potential innovations this will unlock for silicon photonics.”
