Multinational technology company 3M has joined the US-JOINT Consortium, a group of 12 semiconductor suppliers focused on developing next-generation semiconductor advanced packaging and back-end processing technologies. Since its inception, US-JOINT has also been overseeing the construction of an R&D facility in Union City, California, funded by its members. The site is expected to be unveiled later this year in conjunction with a public launch event.
“As the demands of AI and other high-performance computing technologies increase, suppliers must work together to provide comprehensive solutions to tough challenges on increasingly shorter timelines,” said Steven Vander Louw, 3M’s president of display and electronics product platforms. “The companies in the US-JOINT Consortium represent US and Japanese innovation leaders in a range of advanced packaging technologies.”
Hidenori Abe, CTO for semiconductor materials, Resonac, added: “We are delighted to welcome 3M to the US-JOINT Consortium. 3M’s expertise in materials science and commitment to innovation in advanced packaging device and process solutions will be an asset as we work together to solve difficult technical and integration challenges for customers onshore in the United States.”
