Indiana: SK Hynix confirms investment in Indiana advanced chip packaging facility

The South Korean chip manufacturer SK Hynix has confirmed earlier reports about building an advanced chip packaging facility in Indiania as it revealed its plans  to invest $3.87 billion in the plant which will produce next-generation high bandwidth memory (HBM), the highest-performing Dynamic Random Access Memory (DRAM) chips that can be used in GPUs to train AI models.

This site will also function as an R&D facility for AI products and the company plans to collaborate with Purdue University and Ivy Tech Community College to develop training programs.

“We are excited to become the first in the industry to build a state-of-the-art advanced packaging facility for AI products in the United States that will help strengthen supply-chain resilience and develop a local semiconductor ecosystem,” said SK Hynix CEO, Kwak Noh-Jung. “With this new facility, we hope to advance our goal of providing AI memory chips with unmatched capabilities, serving the needs of our customers.”