Qualcomm And AWS Collaborate On Custom AI Silicon For Large-Scale Data Centers

Qualcomm is partnering with Amazon to develop customized AI infrastructure solutions. Under the multi-generational partnership, Qualcomm Technologies and Amazon will develop custom silicon for large-scale AI data centers, focusing on AI inference and optical connectivity of up to 1.6T. The collaboration will combine Amazon’s AI infrastructure with Qualcomm’s chip design expertise, while new optical solutions will leverage Qualcomm’s SerDes and optical DSP technologies.

“As AI demand accelerates, data center infrastructure will require advances in both computing and connectivity to deliver greater performance with more efficiency,” said Cristiano Amon, president and CEO, Qualcomm Incorporated. “Qualcomm is pleased to work with AWS on customized silicon and connectivity solutions, bringing decades of leadership in advanced processing and power-efficient compute, to deliver breakthrough performance and enable the next generation of AI infrastructure.”

“This collaboration with Qualcomm Technologies builds on a strong foundation of partnership and reflects our shared commitment to pushing the boundaries of what’s possible,” added Prasad Kalyanaraman, vice president, AWS. “By working together on customized silicon and advanced connectivity, we’re delivering more performant, efficient, and cost-effective infrastructure for our customers.”

AWS’ custom silicon includes Trainium and Inferentia AI chips and Graviton CPUs. Trainium3, launched in December 2025, is AWS’ first 3nm AI chip and delivers up to 4.4x more compute performance than its predecessor. Qualcomm launched the Dragonfly C1000 CPU, HBC, and Dragonfly AI300 inference accelerator in June. Meta will use the Dragonfly C1000 in its next-generation servers.