IBM has announced two new AI-focused chips for its Z-systems mainframes at the Hot Chips 2024 event this week in California. The new Telum II chip which was designed to power IBM Z systems features increased frequency, memory capacity, a 40 percent growth in cache, and integrated AI accelerator core as well as a coherently attached Data Processing Unit (DPU) versus the first-generation Telum chip.
“The new technologies are designed to significantly scale processing capacity across next-generation IBM Z mainframe systems helping accelerate the use of traditional AI models and large language AI models in tandem through a new ensemble method of AI,” the company said.
"Our robust, multi-generation roadmap positions us to remain ahead of the curve on technology trends, including escalating demands of AI," said Tina Tarquinio, VP, product management, IBM Z and LinuxONE. "The Telum II Processor and Spyre Accelerator are designed to deliver high-performance, secured, and more power-efficient enterprise computing solutions. After years in development, these innovations will be introduced in our next-generation IBM Z platform so clients can leverage LLMs and generative AI at scale."
