United States: US government awards funding for three R&D facilities under the CHIPS Act

US Department of Commerce and Natcast, operator of the National Semiconductor Technology Center (NSTC), has awarded funding for three R&D facilities under the CHIPS and Science Act;  an NSTC prototyping and National Advanced Packaging Manufacturing Program (NAPMP) advanced packaging piloting facility, an NSTC administrative and design facility, and an NSTC Extreme Ultraviolet (EUV) center. 
 

“To reclaim America’s semiconductor leadership, we can’t just invest in manufacturing capacity, we also need to supercharge our research and development ecosystem,” said US Secretary of Commerce Gina Raimondo.

“The National Semiconductor Technology Center and National Advanced Packaging Manufacturing Program are critical components in making that happen, and with the facilities CHIPS for America will be funding we will drive innovation and help recruit and train the next generation of American semiconductor workers.”