Swiss startup to use metal foam for cooling data centers

 Swiss company Apheros this week raised $1.85 million in a funding round led by venture capital firm Founderful to help commercialize its metal foam product. The foam is meant to cover the chip, which helps dissipate the heat generated during use through its large surface area. The company noted that this funding will accelerate the development and deployment of Apheros' metal foam-based cooling solutions. 
 

Julia Carpenter, co-founder and CEO of Apheros, said: "Our technology has the potential to set new industry standards and significantly reduce the environmental impact of cooling solutions worldwide. This funding round will allow us to advance our mission of helping our customers achieve superior thermal performance, increase energy efficiency, and contribute to a greener future. Immediately, we will expand production, increase research and development efforts, and bring state-of-the-art solutions to a broader market.”

Gaëlle Andreatta, co-founder and CTO of Apheros, added: “There is a dire need for more efficient cooling solutions. AI development is driving exponential growth in data center energy consumption and inefficient cooling is the main culprit. Our unique metal foams have superior heat exchange and fluid transport properties, especially for liquid and two-phase cooling. With our customers, we are redefining thermal management.”