Jan 03, 2025 | Posted by Abdul-Rahman Oladimeji
Samsung Electronics’ VP for advanced packaging technology has left the company. Lin Jun-Cheng also confirmed his resignation, posting on LinkedIn that he was leaving “due to the end of my two-year contract.”
Jun-Cheng joined the company in March 2023 having previously worked at TSMC for almost two decades. While at TSMC, he helped lay the groundwork for the chipmaker’s 3D packaging technology and was involved with the filing of more than 450 US patent applications by the company.
“I am pleased to have contributed to the advancement of both the company and my career through the application of Samsung's advanced packaging technologies, including hybrid copper bonding for 3DIC and HBM-16H, I-CubeE, I-CubeR, and CPO,” Jun-Cheng wrote on LinkedIn, adding that his former colleagues should “keep up the good work.”
