United States: Iceotope claims achievement of superior chip cooling level

Icetope has claimed that its precision liquid cooling technology has achieved chip-level cooling up to and beyond 1000W, reaching an important industry milestone for overcoming the challenges of rising thermal design power. In a new report published by the company, it claimed that at a flow rate of 7 l/min, Iceotope’s copper-pinned KUL SINK achieved a thermal resistance of 0.039 K/W when a 1000W heat load was applied to an Intel thermal emulator.

“Iceotope Precision Liquid Cooling technology has achieved an important industry milestone by demonstrating enhanced thermal performance capability compared to other competing liquid cooling technologies,” said Neil Edmunds, VP of product management at Iceotope.

“We are confident that future testing of our standard solution at elevated power levels will demonstrate further inherent cooling capability. Iceotope are also continuing to develop new solutions which enable even higher roadmap power levels to be attained in a safe, sustainable and scalable way.”