United States: Eiyan closes $60 million Series B funding round

Chiplet interconnect manufacturer Eliyan has closed a $60 million Series B funding round co-led by Samsung Catalyst Fund and Tiger Global Management and included participation from existing investors, including Intel Capital, SK Hynix, Cleveland Avenue, and Mesh Ventures.

The funding round follows a $40 million Series A round that the company closed in 2022. Eliyan said that the funding will allow the company to continue addressing the “most pressing challenges facing the design and manufacturing of advanced AI chips” by further developing its chiplet interconnect technology to enable chip makers to “achieve new levels of performance and power efficiency.”

He added: “[The funding will] turn our unique technologies into ultimate chiplet products that will empower the future AI systems. Many thanks to our great team for their commitment and many thanks to our partners, customers and investors for their trust in our ability to execute and deliver the best.”