OCP APAC Summit 2027
About the Event
The OCP APAC Summit is the Open Compute Project's Asia-Pacific gathering, scheduled for August 9 to 11, 2027 in Taipei, Taiwan. Organized by the Open Compute Project Foundation, the conference brings together hyperscale operators, original design manufacturers (ODMs), silicon providers, and facilities engineers across the region. Prior editions have drawn nearly 2,500 registered attendees from more than 1,000 organizations and 36 countries, featuring more than 250 speakers across technical tracks and an active expo floor.
Programming Focus
- Open hardware and reference-design contributions across server, storage, and networking subsystems
- AI-ready, high-density computing clusters and rack-level architectures
- Liquid cooling systems, thermal management, and smart-controlled cooling for high-TDP processors
- Power distribution and efficiency, including transitions to high-density DC distribution
- Supply chain security, firmware integrity, and open standards across APAC manufacturing ecosystems
- The OCP Future Technologies Symposium, showcasing early-stage research in data center hardware and sustainability
Who Should Attend
- Hyperscalers, cloud service providers, and regional data center operators
- Hardware engineering teams, ODMs, and server/rack manufacturers
- Thermal, mechanical, and electrical infrastructure engineers
- Silicon, component, and optics vendors
- Academic researchers and early-stage infrastructure technology startups
Logistics
The summit takes place August 9–11, 2027 in Taipei, Taiwan. Call for Presentations and registration open through the Open Compute Project portal.